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6 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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| GLOBAL STOCKS | |||||||||||||||||||
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4,351
In-stock
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Laird Technologies EMI | DCON,15P,SNPB | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.025" (0.64mm) | 1.740" (44.20mm) | 0.690" (17.53mm) | Lead, Tin | 299.21µin (7.60µm) | Slot | ||||
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3,814
In-stock
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Laird Technologies EMI | AP,STR,SNPB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,674
In-stock
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Laird Technologies EMI | TWT,STR,SNPB,PSA | Twist | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,629
In-stock
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Laird Technologies EMI | TWT,STR,SNPB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Lead, Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,656
In-stock
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Laird Technologies EMI | DCON,9P,SNPB | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.025" (0.64mm) | 1.410" (35.81mm) | 0.690" (17.53mm) | Lead, Tin | 299.21µin (7.60µm) | Slot | ||||
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4,580
In-stock
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Laird Technologies EMI | TWT,STR,SNPB,DLN | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.210" (5.33mm) | Lead, Tin | 299.21µin (7.60µm) | Clip | ||||
