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10 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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3,740
In-stock
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Laird Technologies EMI | CSTR COIL ZNY | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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3,576
In-stock
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Laird Technologies EMI | CSTR COIL NIB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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5,976
In-stock
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Laird Technologies EMI | CSTR COIL NIE | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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3,369
In-stock
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Laird Technologies EMI | CSTR COIL SNB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Tin | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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3,519
In-stock
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Laird Technologies EMI | CSTR COIL SNB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Tin | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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4,619
In-stock
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Laird Technologies EMI | CSTR COIL NIE | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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4,973
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 24MMX406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 0.375" (9.53mm) | 0.940" (23.88mm) | - | - | Hardware, Rivet, Solder | ||||
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4,088
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware, Rivet, Solder | ||||
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5,197
In-stock
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Laird Technologies EMI | CSTR,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 25.000 (7.60m) | 1.630" (41.40mm) | - | - | Hardware, Rivet, Solder | ||||
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5,346
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 27.69MMX406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware, Rivet, Solder | ||||
