- Manufacture :
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43 results
Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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GLOBAL STOCKS | ||||||||||||||||||||
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2,651
In-stock
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Leader Tech Inc. | 0.067 X 0.19 NI 18--8-19PCI-NI-1 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 18.000" (457.20mm) | 0.190" (4.83mm) | Nickel | Flash | Adhesive | ||||
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3,518
In-stock
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Leader Tech Inc. | .080"H X 394"W X 48"L--D SHAPED- | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | D-Shape | 0.080" (2.03mm) | 4.00 (1.22m) | 0.394" (10.01mm) | - | - | - | ||||
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3,005
In-stock
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Leader Tech Inc. | .080"H X .160"W X 9"L--D SHAPED- | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | D-Shape | 0.080" (2.03mm) | 9.000" (228.60mm) | 0.160" (4.06mm) | - | - | - | ||||
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3,204
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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4,545
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,374
In-stock
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Laird Technologies EMI | NOSG,STR,ZNC,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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4,321
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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5,016
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 11.176X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||||
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5,350
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 11.176X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||||
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3,542
In-stock
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Laird Technologies EMI | CLO,STRSNB,USFT | Clip-On | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | Tin | 299.21µin (7.60µm) | Clip | ||||
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3,422
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,502
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
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4,131
In-stock
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Laird Technologies EMI | CLO,STR,BF,USFT | Clip-On | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||||
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4,473
In-stock
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Leader Tech Inc. | .080"H X .200"W X 24"L--RECTANGU | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | Rectangular | 0.080" (2.03mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | - | - | - | ||||
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4,385
In-stock
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Leader Tech Inc. | .080"H X 394"W X 12"L--D SHAPED- | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | D-Shape | 0.080" (2.03mm) | 12.000" (304.80mm) | 0.394" (10.01mm) | - | - | - | ||||
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3,430
In-stock
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Leader Tech Inc. | 0.08 X 0.45 BD 16--8-45LPAH-BD-1 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | ||||
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2,655
In-stock
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Leader Tech Inc. | 0.09 X 0.92 BD 16--8-92RC-BD-16- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.920" (23.37mm) | Unplated | - | Adhesive | ||||
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2,716
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USFT | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||||
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3,353
In-stock
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Laird Technologies EMI | GASKET BECU ALLOY 11.43X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
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4,883
In-stock
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Laird Technologies EMI | FINGERSTCK ULTRASFT 6.35X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||||
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3,964
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,078
In-stock
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Leader Tech Inc. | 0.08 X 0.25 BD 400--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 33.33 (10.16m) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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4,619
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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5,503
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,851
In-stock
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Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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2,715
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 25.000 (7.62m) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,090
In-stock
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Laird Technologies EMI | NOSG COIL NIB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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3,688
In-stock
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Laird Technologies EMI | NOSG COIL ZNY PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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5,642
In-stock
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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3,085
In-stock
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Leader Tech Inc. | .080"H X .275"W X 48"L--RECTANGU | - | Active | Polyurethane Foam, Nickel-Copper Polyester (NI/CU) | -40°C ~ 70°C | Fabric Over Foam | Rectangular | 0.080" (2.03mm) | 4.00 (1.22m) | 0.275" (6.99mm) | - | - | - |