- Manufacture :
- Series :
- Operating Temperature :
- Plating :
- Plating - Thickness :
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16 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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2,677
In-stock
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Laird Technologies EMI | GASKET BECU 28.7X304.8MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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4,700
In-stock
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Laird Technologies EMI | AP,STR,SNSAT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,583
In-stock
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Leader Tech Inc. | 0.41 X 1.13 X SN 16--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.410" (10.41mm) | 16.000" (406.40mm) | 1.130" (28.70mm) | Tin | Flash | Adhesive | ||||
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5,112
In-stock
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Leader Tech Inc. | 0.41 X 1.63 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.410" (10.41mm) | 16.000" (406.40mm) | 1.630" (41.40mm) | Unplated | - | Adhesive | ||||
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3,054
In-stock
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Leader Tech Inc. | 0.41 X 1.13 X BD 16--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.410" (10.41mm) | 16.000" (406.40mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | ||||
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3,519
In-stock
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Laird Technologies EMI | CSTR COIL SNB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Tin | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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4,619
In-stock
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Laird Technologies EMI | CSTR COIL NIE | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||||
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2,888
In-stock
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Leader Tech Inc. | 0.41 X 1.13 X BD 12--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | ||||
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4,470
In-stock
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Laird Technologies EMI | CSTR COIL BF USF | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Unplated | - | Adhesive | ||||
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2,608
In-stock
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Leader Tech Inc. | 0.41 X 1.13 BD 12--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | ||||
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5,646
In-stock
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Laird Technologies EMI | GASKET BECU 28.7X304.8MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | - | - | Adhesive | ||||
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5,197
In-stock
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Laird Technologies EMI | CSTR,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 25.000 (7.60m) | 1.630" (41.40mm) | - | - | Hardware, Rivet, Solder | ||||
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5,068
In-stock
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Leader Tech Inc. | 0.41 X 1.13 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.410" (10.41mm) | 16.000" (406.40mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | ||||
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5,333
In-stock
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Laird Technologies EMI | GASKET BECU 28.7X304.8MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | - | - | Adhesive | ||||
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3,761
In-stock
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Leader Tech Inc. | 0.41 X 1.13 SN 12--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | Flash | Adhesive | ||||
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2,742
In-stock
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Laird Technologies EMI | AP,STR,SNB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
