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34 results
Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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GLOBAL STOCKS | ||||||||||||||||||||
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5,715
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,848
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | ||||
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4,321
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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4,584
In-stock
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Unplated | - | Adhesive | ||||
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2,716
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USFT | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||||
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3,671
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,014
In-stock
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Laird Technologies EMI | GASKET BECU 9.65X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Adhesive | ||||
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4,152
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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2,998
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,531
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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5,036
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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4,883
In-stock
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Laird Technologies EMI | FINGERSTCK ULTRASFT 6.35X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||||
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2,698
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,964
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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4,905
In-stock
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Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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5,191
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | 299.21µin (7.60µm) | Adhesive | ||||
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4,619
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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5,503
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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4,052
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USFT,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | - | Adhesive | ||||
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2,851
In-stock
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Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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2,715
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 25.000 (7.62m) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,090
In-stock
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Laird Technologies EMI | NOSG COIL NIB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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3,688
In-stock
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Laird Technologies EMI | NOSG COIL ZNY PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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3,746
In-stock
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Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | - | - | Adhesive | ||||
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4,807
In-stock
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | ||||
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5,642
In-stock
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||||
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5,213
In-stock
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,616
In-stock
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Laird Technologies EMI | NOSG,STR,BF | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||||
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5,579
In-stock
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Laird Technologies EMI | GASKET BECU 19.3X609.6MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | ||||
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4,964
In-stock
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Laird Technologies EMI | GASKET BECU ALLOY 13X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | - | Adhesive |