- Manufacture :
- Operating Temperature :
- Height :
- Plating :
- Plating - Thickness :
- Attachment Method :
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9 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||
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2,673
In-stock
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Laird Technologies EMI | FINGERSTOCK BECU 6.6X609.6MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | - | - | Snap-In | ||||
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5,878
In-stock
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Laird Technologies EMI | GASKET BECU 6.6X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | - | - | Adhesive | ||||
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5,036
In-stock
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Laird Technologies EMI | AP,STR,SNB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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4,924
In-stock
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Laird Technologies EMI | AP,STR,SNSAT,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,510
In-stock
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Leader Tech Inc. | 0.11 X 0.26 AU 16--10-26UD-AU-16 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Gold | Flash | Adhesive | ||||
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3,158
In-stock
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Leader Tech Inc. | 0.10 X 0.26 NI 16--10-26UD-NI-16 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Nickel | Flash | Adhesive | ||||
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4,576
In-stock
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Leader Tech Inc. | 0.10 X 0.26 SN 16--10-26UD-SN-16 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | Flash | Adhesive | ||||
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4,607
In-stock
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Laird Technologies EMI | FLX,STR,SNB | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Snap-In | ||||
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4,518
In-stock
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Leader Tech Inc. | 0.10 X 0.26 BD 16--10-26UD-BD-16 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Unplated | - | Adhesive | ||||
