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57 results
Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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GLOBAL STOCKS | ||||||||||||||||||||
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3,155
In-stock
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Laird Technologies EMI | AP,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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2,952
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,083
In-stock
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Leader Tech Inc. | 0.13 X 0.37 ST 16.0--13-S-37AH-S | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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3,119
In-stock
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Laird Technologies EMI | AP COIL NIB PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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4,153
In-stock
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Laird Technologies EMI | GASKET BECU 9.4X406.4MM | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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2,618
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,941
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
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3,517
In-stock
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Laird Technologies EMI | NOSG,STR,NIB,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Slot | ||||
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2,627
In-stock
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Slot | ||||
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2,896
In-stock
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Laird Technologies EMI | AP COIL BF PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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3,850
In-stock
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Leader Tech Inc. | 0.13 X 0.37 NI 16--13-37AH-NI-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | Flash | Adhesive | ||||
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3,786
In-stock
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Leader Tech Inc. | 0.13 X 0.37 SN 16.0--13-37AH-SN- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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3,480
In-stock
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Laird Technologies EMI | GASKET BECU 9.4X18.4MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 0.725" (18.42mm) | 0.370" (9.40mm) | - | - | Slot | ||||
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3,331
In-stock
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Leader Tech Inc. | 0.14 X 0.36 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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3,830
In-stock
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Leader Tech Inc. | 0.11 X 0.375 SN 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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4,200
In-stock
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Laird Technologies EMI | GASKET BECU 9.4X406.40MM | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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5,741
In-stock
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Laird Technologies EMI | .140X.370 GASKET FABRIC O/ FOAM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||||
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3,238
In-stock
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Leader Tech Inc. | 0.14 X 0.37 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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2,762
In-stock
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Leader Tech Inc. | 0.14 X 0.36 BD SN 16--FOLDED SER | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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2,979
In-stock
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Leader Tech Inc. | 0.14 X 0.37 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
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3,890
In-stock
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Laird Technologies EMI | AP,STR,NIB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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4,162
In-stock
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Laird Technologies EMI | AP,STR,SNB,USFT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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4,106
In-stock
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Leader Tech Inc. | 0.14 X 0.36 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
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4,937
In-stock
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Leader Tech Inc. | 0.11 X 0.375 BD 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
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4,938
In-stock
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Leader Tech Inc. | 0.14 X 0.37 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
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3,039
In-stock
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Leader Tech Inc. | 0.13 X 0.37 BD 16--13-S-37AH-BD- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | ||||
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2,672
In-stock
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Laird Technologies EMI | AP,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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5,818
In-stock
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Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,964
In-stock
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Laird Technologies EMI | AP,STR,SNSAT,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,405
In-stock
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Laird Technologies EMI | GASKET BECU 9.4X406.40MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive |