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22 results
Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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GLOBAL STOCKS | ||||||||||||||||||||
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3,980
In-stock
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Laird Technologies EMI | AP COIL BF USFT PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
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5,798
In-stock
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Laird Technologies EMI | GASKET BECU 7.11X609.6MM | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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5,810
In-stock
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Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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4,621
In-stock
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Laird Technologies EMI | AP,STR,SU,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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5,857
In-stock
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Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,324
In-stock
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Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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4,928
In-stock
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Laird Technologies EMI | AP,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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5,451
In-stock
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Laird Technologies EMI | AP,STR,NIE,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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5,297
In-stock
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Laird Technologies EMI | AP,STR,ZNY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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3,055
In-stock
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Laird Technologies EMI | AP,STR,ZNC,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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5,991
In-stock
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Laird Technologies EMI | AP,STR,NID,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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2,715
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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4,850
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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5,805
In-stock
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
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3,597
In-stock
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Laird Technologies EMI | AP,STR,BF,USF,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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4,217
In-stock
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Laird Technologies EMI | AP,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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4,679
In-stock
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Laird Technologies EMI | AP COIL BF | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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3,566
In-stock
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Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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4,667
In-stock
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Laird Technologies EMI | GASKET BECU 7.11X18.54MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.280" (7.11mm) | - | - | Slot | ||||
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4,448
In-stock
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Laird Technologies EMI | GASKET BECU 7.11X13.82MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.543" (13.79mm) | 0.280" (7.11mm) | - | - | Slot | ||||
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2,724
In-stock
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Laird Technologies EMI | GASKET BECU 7.11X9.04MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.280" (7.11mm) | - | - | Slot | ||||
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5,591
In-stock
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Laird Technologies EMI | GASKET BECU 7.11X4.32MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.280" (7.11mm) | - | - | Slot |