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10 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package | Voltage - Supply | Memory Type | Memory Size | Access Time | Memory Format | Write Cycle Time - Word, Page | Memory Interface | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
4,669
In-stock
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Microchip Technology | IC EEPROM 4MBIT 250NS 32FLATPACK | - | Obsolete | Tube | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 250ns | EEPROM | 10ms | Parallel | |||
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RFQ |
5,927
In-stock
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Microchip Technology | IC EEPROM 4MBIT 250NS 32FLATPACK | - | Obsolete | Tube | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 250ns | EEPROM | 10ms | Parallel | |||
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RFQ |
3,682
In-stock
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Microchip Technology | IC EEPROM 4MBIT 200NS 32FP | - | Obsolete | Tube | -40°C ~ 85°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 200ns | EEPROM | 10ms | Parallel | |||
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RFQ |
4,609
In-stock
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Microchip Technology | IC EEPROM 4MBIT 200NS 32FLATPACK | - | Obsolete | Tube | 0°C ~ 70°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 4Mb (512K x 8) | 200ns | EEPROM | 10ms | Parallel | |||
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RFQ |
5,926
In-stock
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | |||
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5,087
In-stock
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | ||||
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4,130
In-stock
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Microchip Technology | IC EEPROM 1MBIT 120NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 120ns | EEPROM | 10ms | Parallel | ||||
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5,263
In-stock
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Microchip Technology | IC EEPROM 1MBIT 150NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 150ns | EEPROM | 10ms | Parallel | ||||
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4,933
In-stock
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Microchip Technology | IC EEPROM 1MBIT 250NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 250ns | EEPROM | 10ms | Parallel | ||||
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5,612
In-stock
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Microchip Technology | IC EEPROM 1MBIT 200NS 32FLATPACK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 32-CFlatpack | 32-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 1Mb (128K x 8) | 200ns | EEPROM | 10ms | Parallel | ||||
