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12 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Part Status | Packaging | Operating Temperature | Mounting Type | Features | Package / Case | Type | Output Type | Supplier Device Package | Voltage - Supply | Max Output Power x Channels @ Load | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||
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RFQ |
5,709
In-stock
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Maxim Integrated | IC AMP AUDIO PWR .33W MONO 8TDFN | Obsolete | Tape & Reel (TR) | -40°C ~ 85°C (TA) | Surface Mount | Depop, Shutdown, Thermal Protection | 8-WDFN Exposed Pad | Class AB | 1-Channel (Mono) | 8-TDFN-EP (3x3) | 2.3 V ~ 5.5 V | 330mW x 1 @ 16 Ohm | |||
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RFQ |
4,624
In-stock
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Maxim Integrated | IC AMP AUDIO PWR .33W MONO 8TDFN | Obsolete | Tape & Reel (TR) | -40°C ~ 85°C (TA) | Surface Mount | Depop, Shutdown, Thermal Protection | 8-WDFN Exposed Pad | Class AB | 1-Channel (Mono) | 8-TDFN-EP (3x3) | 2.3 V ~ 5.5 V | 330mW x 1 @ 16 Ohm | |||
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RFQ |
5,715
In-stock
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Maxim Integrated | IC AMP AUDIO PWR .33W MONO 8TDFN | Obsolete | Tape & Reel (TR) | -40°C ~ 85°C (TA) | Surface Mount | Depop, Shutdown, Thermal Protection | 8-WDFN Exposed Pad | Class AB | 1-Channel (Mono) | 8-TDFN-EP (3x3) | 2.3 V ~ 5.5 V | 330mW x 1 @ 16 Ohm | |||
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RFQ |
5,392
In-stock
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NXP USA Inc. | IC HEADPHONE DVR CLASS G 16WLCSP | Obsolete | Tape & Reel (TR) | -40°C ~ 85°C (TA) | Surface Mount | Depop, I²C, Short-Circuit and Thermal Protection, Shutdown, Volume Control | 16-UFBGA, WLCSP | Class G | 2-Channel (Stereo) | 16-WLCSP (1.7x1.7) | 2.3 V ~ 5.5 V | 25mW x 2 @ 32 Ohm | |||
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RFQ |
4,904
In-stock
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ams | IC HEADPHONE AMP STER H 16-WLCSP | Obsolete | Tape & Reel (TR) | - | Surface Mount | Differential Inputs, I²C, Short-Circuit and Thermal Protection, Shutdown, Volume Control | 16-UFBGA, WLCSP | Class H | Headphones, 2-Channel (Stereo) | 16-WLCSP (1.62x1.62) | 2.3 V ~ 5.5 V | 30mW x 2 @ 16 Ohm | |||
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RFQ |
3,442
In-stock
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ams | IC HEADPHONE AMP STER H 16-WLCSP | Obsolete | Tape & Reel (TR) | - | Surface Mount | Differential Inputs, I²C, Short-Circuit and Thermal Protection, Shutdown, Volume Control | 16-UFBGA, WLCSP | Class H | Headphones, 2-Channel (Stereo) | 16-WLCSP (1.62x1.62) | 2.3 V ~ 5.5 V | 30mW x 2 @ 16 Ohm | |||
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5,040
In-stock
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Diodes Incorporated | IC AMP AUD 16VPP CLASS D 16UQFN | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | Surface Mount | - | 16-UFQFN Exposed Pad | Class D | 1-Channel (Mono) | 16-UQFN-EP (3x3) | 2.3 V ~ 5.5 V | - | ||||
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4,399
In-stock
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ams | IC HEADPHONE AMP STER G 16-WLCSP | Last Time Buy | Tape & Reel (TR) | - | Surface Mount | Differential Inputs, I²C, Short-Circuit and Thermal Protection, Shutdown, Volume Control | 16-UFBGA, WLCSP | Class G | Headphones, 2-Channel (Stereo) | 16-WLCSP (1.62x1.62) | 2.3 V ~ 5.5 V | 30mW x 2 @ 16 Ohm | ||||
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3,955
In-stock
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ams | IC HEADPHONE AMP STER H 16-WLCSP | Active | Tape & Reel (TR) | - | Surface Mount | Differential Inputs, I²C, Short-Circuit and Thermal Protection, Shutdown, Volume Control | 16-UFBGA, WLCSP | Class H | Headphones, 2-Channel (Stereo) | 16-WLCSP (1.62x1.62) | 2.3 V ~ 5.5 V | 30mW x 2 @ 16 Ohm | ||||
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4,576
In-stock
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ams | IC HEADPHONE AMP STER H 16-WLCSP | Active | Tape & Reel (TR) | - | Surface Mount | Differential Inputs, I²C, Short-Circuit and Thermal Protection, Shutdown, Volume Control | 16-UFBGA, WLCSP | Class H | Headphones, 2-Channel (Stereo) | 16-WLCSP (1.62x1.62) | 2.3 V ~ 5.5 V | 30mW x 2 @ 16 Ohm | ||||
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4,026
In-stock
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ams | IC HEADPHONE AMP STER G 16-WLCSP | Active | Tape & Reel (TR) | - | Surface Mount | Differential Inputs, I²C, Short-Circuit and Thermal Protection, Shutdown, Volume Control | 16-UFBGA, WLCSP | Class G | Headphones, 2-Channel (Stereo) | 16-WLCSP (1.62x1.62) | 2.3 V ~ 5.5 V | 30mW x 2 @ 16 Ohm | ||||
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5,715
In-stock
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Diodes Incorporated | AUDIO HIGH VOLT U-QFN3030-12 T&R | Active | - | -40°C ~ 85°C (TA) | Surface Mount | - | - | Class D | 1-Channel (Mono) | - | 2.3 V ~ 5.5 V | - | ||||
