- Packaging :
- Operating Temperature :
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35 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Applications | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Core Processor | Number of I/O | RAM Size | Program Memory Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
3,805
In-stock
|
Microchip Technology | IC CRYPTO TPM 40QFN | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | - | Trusted Platform Module (TPM) | - | SPI | - | 3.3V | AVR | 4 | - | - | |||
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RFQ |
3,828
In-stock
|
Microchip Technology | PL250A-AKU-Y SAMG55J19A-MU LQFP | - | Active | - | -40°C ~ 85°C | - | Power Line Communications | - | SPI | - | 3 V ~ 3.6 V | External | - | - | - | |||
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RFQ |
5,361
In-stock
|
Microchip Technology | PL230A-AKU-Y SAMG55J19A-MU LQFP | - | Active | - | -40°C ~ 85°C | - | Power Line Communications | - | SPI | - | 3 V ~ 3.6 V | External | - | - | - | |||
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RFQ |
5,895
In-stock
|
Microchip Technology | PL250A-AKU-R SAMG55J19A-MUT LQFP | - | Active | - | -40°C ~ 85°C | - | Power Line Communications | - | SPI | - | 3 V ~ 3.6 V | External | - | - | - | |||
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RFQ |
5,839
In-stock
|
Microchip Technology | PL230A-AKU-R SAMG55J19A-MUT LQFP | - | Active | - | -40°C ~ 85°C | - | Power Line Communications | - | SPI | - | 3 V ~ 3.6 V | External | - | - | - | |||
|
|
2,807
In-stock
|
Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -20°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | SPI | PG-VQFN-32-13 | 1.65 V ~ 3.6 V | 16-Bit | 1 | - | - | |||||
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3,321
In-stock
|
Infineon Technologies | SECURITY IC'S/AUTHENTICATION IC' | Active | Tape & Reel (TR) | -20°C ~ 85°C | Surface Mount | Embedded Security Trusted Computing | 32-VFQFN Exposed Pad | SPI | PG-VQFN-32-13 | 1.65 V ~ 3.6 V | 16-Bit | 1 | - | - | |||||
|
|
4,057
In-stock
|
Echelon Corporation | COMM PROCESSOR W/FOUR NEURON COR | IzoT™ | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Smart Transceiver | 48-VFQFN Exposed Pad | SPI | 48-QFN (7x7) | 3 V ~ 3.6 V | Neuron | 12 | 64K x 8 | External Program Memory | ||||
|
|
4,752
In-stock
|
Microchip Technology | IC CRYPTO TPM 28TSSOP | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | SPI | 28-TSSOP | 3.3V | AVR | 4 | - | - | ||||
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|
5,064
In-stock
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Echelon Corporation | TRANC CHIP W/INTEGRATED NEURON C | IzoT™ | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Smart Transceiver | 48-VFQFN Exposed Pad | SPI | 48-QFN (7x7) | 3 V ~ 3.6 V | Neuron | 12 | 64K x 8 | External Program Memory | ||||
|
|
5,070
In-stock
|
Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||||
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4,760
In-stock
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Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||||
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4,575
In-stock
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Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||||
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2,614
In-stock
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Microchip Technology | IC PWR LINE MCU 80LQFP | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Power Line Communications | 80-LQFP | SPI | 80-LQFP (12x12) | 3 V ~ 3.6 V | External | - | - | - | ||||
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3,387
In-stock
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Echelon Corporation | TRANC CHIP W/INTEGRATED NEURON C | IzoT™ | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Smart Transceiver | 48-VFQFN Exposed Pad | SPI | 48-QFN (7x7) | 3 V ~ 3.6 V | Neuron | 12 | 64K x 8 | External Program Memory | ||||
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3,107
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN SEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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3,766
In-stock
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Microchip Technology | PROD FF IND SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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4,934
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN UEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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5,205
In-stock
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Microchip Technology | PROD FF IND SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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4,931
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN CEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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5,539
In-stock
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Microchip Technology | PROD FF COM SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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4,256
In-stock
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Microchip Technology | FF COM SPI TPM 4X4 32VQFN SEK - | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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3,249
In-stock
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Microchip Technology | FF COM SPI TPM 4X4 32VQFN UEK - | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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3,305
In-stock
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Microchip Technology | PROD FF COM SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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4,318
In-stock
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Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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5,092
In-stock
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Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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|
4,518
In-stock
|
Microchip Technology | IC CRYPTO TPM 28TSSOP | - | Active | Tube | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | SPI | 28-TSSOP | 3.3V | AVR | 4 | - | - | ||||
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4,570
In-stock
|
Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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|
|
5,768
In-stock
|
Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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3,239
In-stock
|
Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
