- Manufacture :
- Series :
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- Package / Case :
- Supplier Device Package :
- Peripherals :
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19 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||
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RFQ |
4,580
In-stock
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 516BGA | MPC57xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | |||
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RFQ |
5,802
In-stock
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 416BGA | MPC57xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | |||
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4,078
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,427
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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3,835
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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3,411
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,930
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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2,664
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,374
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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2,701
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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3,084
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,258
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,455
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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4,135
In-stock
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Infineon Technologies | IC MCU 32BIT 8MB FLASH 516LFBGA | AURIX™ | Not For New Designs | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-LFBGA | PG-LFBGA-516-5 | DMA, WDT | TriCore™ | 300MHz | 3.3V, 5V | 263 | 2.75M x 8 | 32-Bit | ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT | 8MB (8M x 8) | Flash | 384K x 8 | A/D 84x12b, 10 x Sigma-Delta | External | ||||
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4,987
In-stock
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Infineon Technologies | IC MCU 32BIT 8MB FLASH 292LFBGA | AURIX™ | Not For New Designs | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 292-LFBGA | PG-LFBGA-292-6 | DMA, WDT | TriCore™ | 300MHz | 3.3V, 5V | 169 | 2.75M x 8 | 32-Bit | ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT | 8MB (8M x 8) | Flash | 384K x 8 | A/D 60x12b, 10 x Sigma-Delta | External | ||||
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5,415
In-stock
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Infineon Technologies | IC MCU 32BIT 8MB FLASH 292LFBGA | AURIX™ | Not For New Designs | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 292-LFBGA | PG-LFBGA-292-6 | DMA, WDT | TriCore™ | 300MHz | 3.3V, 5V | 169 | 2.75M x 8 | 32-Bit | ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT | 8MB (8M x 8) | Flash | 384K x 8 | A/D 60x12b, 10 x Sigma-Delta | External | ||||
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4,936
In-stock
|
Infineon Technologies | IC MCU 32BIT 8MB FLASH 292LFBGA | AURIX™ | Not For New Designs | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 292-LFBGA | PG-LFBGA-292-6 | DMA, WDT | TriCore™ | 300MHz | 3.3V, 5V | 263 | 2.75M x 8 | 32-Bit | ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT | 8MB (8M x 8) | Flash | 384K x 8 | A/D 60x12b, 10 x Sigma-Delta | External | ||||
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4,012
In-stock
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Infineon Technologies | IC MCU 32BIT 8MB FLASH 516LFBGA | AURIX™ | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | - | - | DMA, WDT | TriCore™ | 300MHz | 3.3V, 5V | 263 | 728K x 8 | 32-Bit | ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT | 8MB (8M x 8) | Flash | 384K x 8 | A/D 84x12b, 10 x Sigma-Delta | External | ||||
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4,274
In-stock
|
Infineon Technologies | 32 BIT AURIX | AURIX™ | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 292-LFBGA | PG-LFBGA-292-6 | DMA, WDT | TriCore™ | 300MHz | 1.17 V ~ 1.43 V, 2.97 V ~ 5.5 V | 263 | 240K x 8 | 32-Bit | ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT | 8MB (8M x 8) | Flash | 768K x 8 | A/D 60x12b, 10 x Sigma-Delta | External | ||||
