- Manufacture :
- Series :
- Packaging :
- Supplier Device Package :
- Peripherals :
- Core Processor :
- Speed :
- Voltage - Supply (Vcc/Vdd) :
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18 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||
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3,500
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,807
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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3,572
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,739
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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4,078
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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4,601
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,085
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,374
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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2,701
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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3,084
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,258
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,455
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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4,301
In-stock
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 416BGA | TC17xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA, POR, WDT | TriCore™ | 270MHz | 1.17 V ~ 3.63 V | 221 | 288K x 8 | 32-Bit | ASC, CAN, EBI/EMI, FlexRay, MLI, MSC, SSC | 4MB (4M x 8) | Flash | 192K x 8 | A/D 8x10b, 44x12b | External | ||||
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3,643
In-stock
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Infineon Technologies | IC MCU 32BIT 2MB FLASH 416BGA | TC17xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA, POR, WDT | TriCore™ | 150MHz | 1.42 V ~ 1.58 V | 123 | 256K x 8 | 32-Bit | ASC, CAN, EBI/EMI, MLI, MSC, SSC | 2MB (2M x 8) | Flash | - | A/D 44x12b | External | ||||
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5,668
In-stock
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Infineon Technologies | IC MCU 32BIT 2MB FLASH 416BGA | TC17xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA, POR, WDT | TriCore™ | 150MHz | 1.42 V ~ 1.58 V | 123 | 256K x 8 | 32-Bit | ASC, CAN, EBI/EMI, MLI, MSC, SSC | 2MB (2M x 8) | Flash | - | A/D 44x12b | External | ||||
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3,867
In-stock
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Infineon Technologies | IC MCU 32BIT 2MB FLASH 416BGA | TC17xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA, POR, WDT | TriCore™ | 150MHz | 1.42 V ~ 1.58 V | 123 | 256K x 8 | 32-Bit | ASC, CAN, EBI/EMI, MLI, MSC, SSC | 2MB (2M x 8) | Flash | - | A/D 44x12b | External | ||||
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5,879
In-stock
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 416BGA | TC17xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416-27 | DMA, POR, WDT | TriCore™ | 180MHz | 1.42 V ~ 1.58 V | 221 | 224K x 8 | 32-Bit | ASC, CAN, EBI/EMI, FlexRay, MLI, MSC, SSC | 4MB (4M x 8) | Flash | 64K x 8 | A/D 4x10b, 44x12b | External | ||||
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4,321
In-stock
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NXP USA Inc. | IC MCU 32BIT 8MB FLASH 416BGA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
