- Series :
- Packaging :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- Core Processor :
- Speed :
- RAM Size :
- Core Size :
- Connectivity :
-
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB (2)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG (3)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB (1)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG (3)
- CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART (2)
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11 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||
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3,756
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 282K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 16x10b, 6x12b, D/A 1x10b | Internal | ||||
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5,693
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 144LQFP | LPC18xx | Active | Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 83 | 136K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 8x10b; D/A 1x10b | Internal | ||||
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5,731
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 8x10b, D/A 1x10b | Internal | ||||
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3,091
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 264K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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5,788
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 136K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART | - | ROMless | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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4,268
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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3,357
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 8x10b, D/A 1x10b | Internal | ||||
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4,323
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 136K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART | - | ROMless | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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5,351
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 136K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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3,290
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 105°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 49 | 136K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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4,770
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 144LQFP | LPC43xx | Active | Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 83 | 136K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 8x10b; D/A 1x10b | Internal | ||||
