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| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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3,735
In-stock
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CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||||
