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- Material :
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- Package Cooled :
- Attachment Method :
- Power Dissipation @ Temperature Rise :
- Material Finish :
2 results
Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
5,215
In-stock
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Comair Rotron | HEATSINK STAMP 19X12.8X12.7MM | - | Obsolete | Aluminum | Board Level | Rectangular, Fins | 0.750" (19.05mm) | 0.504" (12.80mm) | TO-220, TO-262 | Clip | 0.500" (12.70mm) | 1.0W @ 30°C | 8.00°C/W @ 300 LFM | - | Black Anodized | |||
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2,701
In-stock
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin |