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4 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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RFQ |
3,306
In-stock
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CTS Thermal Management Products | HEATSINK LOW-PROFILE FORGED | APF | Active | Aluminum | Top Mount | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | |||
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2,870
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 2.500" (63.50mm) | 1.375" (34.93mm) | - | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 8.0W @ 60°C | 4.00°C/W @ 200 LFM | 8.00°C/W | Black Anodized | ||||
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3,888
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 2.500" (63.50mm) | 1.375" (34.93mm) | - | TO-218, TO-247 | Bolt On and PC Pin | 0.500" (12.70mm) | 8.0W @ 60°C | 4.00°C/W @ 200 LFM | 8.00°C/W | Black Anodized | ||||
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3,434
In-stock
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CTS Thermal Management Products | HEATSINK FORGED W/ADHESIVE TAPE | APF | Active | Aluminum | Top Mount | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||||
