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- Material :
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- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Natural :
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3 results
Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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RFQ |
3,746
In-stock
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Comair Rotron | HEATSINK STAMP 19.4X25.4X11.4MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - | Tin | |||
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4,518
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Rhombus | 1.550" (39.37mm) | 1.040" (26.42mm) | TO-66 | Bolt On | 1.250" (31.75mm) | 7.0W @ 50°C | 4.00°C/W @ 200 LFM | 8.00°C/W | Black Anodized | ||||
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3,581
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Rhombus | 1.630" (41.40mm) | 1.290" (32.77mm) | TO-3 | Bolt On | 0.750" (19.05mm) | 2.0W @ 30°C | 4.00°C/W @ 200 LFM | 13.40°C/W | Black Anodized |