- Material :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Natural :
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4 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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| GLOBAL STOCKS | |||||||||||||||||||||||
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5,089
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-202 LOW PROFILE.375" | - | Active | Aluminum | Board Level | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | TO-202 | Bolt On | 0.375" (9.52mm) | 1.0W @ 30°C | 8.00°C/W @ 500 LFM | 27.20°C/W | Black Anodized | ||||
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5,692
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TIN CLIP-ON 13MM | - | Active | Copper | Board Level | Rectangular, Fins | 0.780" (19.81mm) | 0.520" (13.21mm) | - | TO-220 | Clip and PC Pin | 0.515" (13.08mm) | 1.5W @ 50°C | 8.00°C/W @ 500 LFM | 28.30°C/W | Tin | ||||
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5,188
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 CLIP-ON BLK | - | Active | Aluminum | Board Level | Rectangular, Fins | 0.750" (19.05mm) | 0.860" (21.84mm) | - | TO-220 | Clip | 0.395" (10.03mm) | 1.5W @ 40°C | 8.00°C/W @ 500 LFM | 23.20°C/W | Black Anodized | ||||
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5,288
In-stock
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Wakefield-Vette | HEAT SINK BGA/PGA 16.5X16.5X8.9 | Penguin | Active | Aluminum | Board Level | Square, Fins | 0.650" (16.51mm) | 0.653" (16.59mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | - | 8.00°C/W @ 500 LFM | - | Black Anodized | ||||
