- Part Status :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
- Material Finish :
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6 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
4,410
In-stock
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | Black Paint | |||
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|
RFQ |
4,521
In-stock
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | Tin | |||
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5,466
In-stock
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | 13.00°C/W | Tin | ||||
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4,075
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 12.50°C/W | Tin | ||||
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3,326
In-stock
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||||
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3,580
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK COPPER TO-220 W/TABS | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 12.50°C/W | Tin | ||||
