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4 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
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3,705
In-stock
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CTS Thermal Management Products | HEATSINK LOW-PROFILE FORGED | APF | Active | Aluminum | Top Mount | Square, Fins | 1.181" (30.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.250" (6.35mm) | - | 4.40°C/W @ 200 LFM | Black Anodized | ||||
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3,584
In-stock
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CTS Thermal Management Products | HEATSINK LOW-PROFILE FORGED | APF | Active | Aluminum | Top Mount | Square, Fins | 1.575" (40.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | Black Anodized | ||||
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5,250
In-stock
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Wakefield-Vette | HEATSINK CPU 28MM SQ BLK | 658 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | - | BGA | Thermal Tape, Adhesive (Not Included) | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | Black Anodized | ||||
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2,782
In-stock
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CTS Thermal Management Products | HEATSINK LOW-PROFILE FORGED | APF | Active | Aluminum | Top Mount | Square, Fins | 0.748" (19.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | Black Anodized | ||||
