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- Type :
- Shape :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
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3 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||
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5,402
In-stock
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Delta Electronics | HEATSINK ASSY INTEL LGA1366 | - | Active | Aluminum | Board Level | Square | 3.543" (90.00mm) | LGA | Bolt On | 1.004" (25.50mm) | - | 0.27°C/W | - | ||||
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5,060
In-stock
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Delta Electronics | HEATSINK ASSY INTEL NEHALEM 1366 | - | Active | Aluminum | Board Level | Square, Fins | 3.543" (90.00mm) | LGA | Bolt On | 1.004" (25.50mm) | 0.26°C/W | - | - | ||||
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2,637
In-stock
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Aavid, Thermal Division of Boyd Corporation | COPPER HEATSINK 90X90X10MM | - | Active | Copper | Top Mount | Square, Fins | 3.543" (90.00mm) | BGA | Push Pin | 0.394" (10.00mm) | 1.30°C/W @ 200 LFM | 4.50°C/W | AavSHIELD 3C | ||||
