- Height Off Base (Height of Fin) :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
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2 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
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3,326
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||||
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3,826
In-stock
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Apex Microtechnology | HEATSINK SMT | Apex Precision Power® | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD | SMD Pad | 0.400" (10.16mm) | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||||
