- Part Status :
- Length :
- Package Cooled :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
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4 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
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RFQ |
5,874
In-stock
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Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin | |||
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5,136
In-stock
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||||
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4,431
In-stock
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D-PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||||
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5,549
In-stock
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Wakefield-Vette | HEATSINK ALUM BLACK SMD | 218 | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.900" (22.86mm) | - | SMD | SMD Pad | 0.400" (10.16mm) | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | Tin | ||||
