- Part Status :
- Material :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
- Material Finish :
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3 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
5,470
In-stock
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Comair Rotron | HEATSINK STAMP 9.5X22.8X17.8MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | TO-220 | Clip | 0.375" (9.52mm) | 2.0W @ 50°C | 14.00°C/W @ 200 LFM | - | Black Anodized | |||
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5,937
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 0.848" (21.55mm) | 0.900" (22.86mm) | TO-220 | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | ||||
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5,506
In-stock
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CUI Inc. | HEATSINK TO-220 2.6W ALUMINUM | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.375" (9.53mm) | 0.900" (22.86mm) | TO-220 | Clip | 0.740" (18.79mm) | 2.6W @ 75°C | 6.32°C/W @ 200 LFM | 28.85°C/W | Black Anodized | ||||
