- Material :
- Length :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Material Finish :
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2 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
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RFQ |
5,874
In-stock
|
Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | Tin | |||
|
|
RFQ |
5,470
In-stock
|
Comair Rotron | HEATSINK STAMP 9.5X22.8X17.8MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | TO-220 | Clip | 0.375" (9.52mm) | 2.0W @ 50°C | 14.00°C/W @ 200 LFM | Black Anodized | |||
