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4 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
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3,110
In-stock
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Rectangular | 1.000" (25.40mm) | 0.750" (19.05mm) | - | TO-220 | Clip | 0.350" (8.89mm) | 1.0W @ 30°C | 16.00°C/W @ 200 LFM | 26.00°C/W | Black Anodized | ||||
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5,320
In-stock
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t-Global Technology | PH3 76.2X19.1X0.21MM | PH3 | Active | Copper | Heat Spreader | Rectangular | 3.000" (76.20mm) | 0.750" (19.05mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.008" (0.21mm) | - | - | - | Polyester | ||||
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3,522
In-stock
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t-Global Technology | PH3N NANO 76.2X19.1X0.07MM | PH3n | Active | Copper | Heat Spreader | Rectangular | 3.000" (76.20mm) | 0.750" (19.05mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.003" (0.07mm) | - | - | - | Polyester | ||||
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3,330
In-stock
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t-Global Technology | PH3N NANO 76.2X19.1X0.062MM | PH3n | Active | Copper | Heat Spreader | Rectangular | 3.000" (76.20mm) | 0.750" (19.05mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.002" (0.06mm) | - | - | - | Polyester | ||||
