- Manufacture :
- Material :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
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2 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
4,432
In-stock
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Comair Rotron | HEATSINK STAMP 26.2X12.7X9.9MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | - | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | |||
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RFQ |
5,961
In-stock
|
Wakefield-Vette | HEATSINK TO-220 W/PINS | 667 | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.500" (12.70mm) | 1.375" (34.93mm) | - | TO-220 | Bolt On and PC Pin | 1.000" (25.40mm) | 6.0W @ 76°C | 5.80°C/W @ 200 LFM | Black Anodized | |||
