STMicroelectronics ACEPACK™ IGBT Modules

12/27/2018

STMicroelectronics ACEPACK™ IGBT Modules are a family of new plastic power modules developed to address power management solutions and industrial applications. The ACEPACK™ 1 and ACEPACK™ 2 packages are introduced with both Converter Inverter Brake (CIB) and six-pack topologies that integrate the advanced trench-gate field-stop technologies. These ACEPACK IGBT-modules feature ACEPACK 1 or ACEPACK 2 power modules, integrated Negative Temperature Coefficient (NTC), and CIB or six-pack topology. These modules cover the appropriate use of the new IGBT-technology by representing the best compromise between conduction and switching-loss to maximize efficiency by 20kHz. These IGBT modules are ideal for application in industrial motor drives, solar panels, welding, and inverters.

Features                              
  • ACEPACK™ 1 and ACEPACK™ 2 power modules:

    • Direct Bonded Copper (DBC) Cu Al2O3 Cu

  • Converter Inverter Brake (CIB) topology:

    • 1600V blocking voltage

    • 1200V, 25A IGBTs  and  diodes

    • 1.95VCE(sat) @ IC=25A

    • Soft and fast recovery diode

  • Sixpack topology:

    • 1200V, 35A IGBTs  and  diodes

    • 1.95VCE(sat) @ IC=35A

  • Soft and fast recovery diode

  • Integrated NTC

                       
Applications                              
  • Inverters

  • Motor  drives

  • Solar panels

  • Welding

                       
Converter Inverter Brake (CIB) Topology Pin Description and Package Top View

STMicroelectronics ACEPACK™ Converter Inverter Brake (CIB) Topology Pin Description and Package Top View

Sixpack Topology Pin Description and Package Top View

STMicroelectronics ACEPACK™ Sixpack Topology Pin Description and Package Top View


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