Nexperia - Small logic package can be used without a step-down mask
The company developed the packages – part of its MicroPak package range – to offer the smallest footprint for logic functions while assuring pad pitch remains 0.4mm or over. The company’s low-power AUP, AXP, LV and LVC technology families which covers over 100 logic solutions are offered in X2SON eight, six, five and four-pin packages.
The new four-pin X2SON4 package option lessens the footprint of the same function by 44% when compared to five-pin X2SON5, and by up to 64% when compared to XSON packages.
Michael Lyons, senior product manager at Nexperia, commented: “X2SON4 enables the release of smaller buffers and inverters, which were previously only available in five-pin or six-pin leadless packages. All our X2SON solutions enable miniaturisation without the use of expensive and fragile step-down masks.”
Related Part Numbers: (for more parts, you may contact E-MAIL: Sales@chipmarkets.com
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PMN50UPE,115 PHD20N06T,118 BUK9609-75A,118
2N7002PW,115 2N7002PS/ZLX PDTA115EMB,315
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PEMH11,115 PZU3.0B1,115 PZU4.7B1,115
PZU9.1B1A,115 1N4731A,133 BZT52H-C12,115
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